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www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 1/24 4.dec.2013 rev.001 tsz22111 ? 14? 001 datashee t comparators input full swing, open drain output low supply current cmos comparators bu7250g bu7250sg bu7253f bu7253sf general description bu7250g/bu7253f are low supply current and open drain output comparators. bu7250sg/bu7253sf have an expanded operating temperature range. these features low operating supply voltage of +1.8v to +5.5v, low supply current and extremely low input bias current. features ? low operating supply voltage ? low supply current ? high speed operation ? input full swing ? open drain output type ? wide operating temperature range applications ? battery monitor ? mobile equipments ? limit comparator ? consumer electronics key specifications ? operating supply voltage: single supply +1.8v to +5.5v split supply 0.9v to 2.75v ? supply current: bu7250g/bu7250sg 15a bu7253f/bu7253sf 35a ? temperature range: bu7250g/bu7253f -40c to +85c bu7250sg/bu7253sf -40c to +105c ? input offset current: 1pa (typ) ? input bias current: 1pa (typ) packages j w(typ) x d(typ) x h(max) ssop5 2.90mm x 2.80mm x 1.25mm sop8 5.00mm x 6.20mm x 1.71mm pin configuration bu7250g, bu7250sg: ssop5 pin no. pin name 1 in- 2 vss 3 in+ 4 out 5 vdd bu7253f, bu7253sf: sop8 pin no. pin name 1 out1 2 in1- 3 in1+ 4 vss 5 in2+ 6 in2- 7 out2 8 vdd 1 + \ 2 3 4 5 vss in+ in- vdd out + ch2 - + ch1 - + 1 2 3 4 8 7 6 5 vss out1 in1- in1+ out2 vdd in2+ in2- product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays.
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 2/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf package ssop5 sop8 bu7250g bu7250sg bu7253f bu7253sf ordering information b u 7 2 5 x x x - x x part number package packaging and forming specification bu7250g bu7250sg bu7253f bu7253sf g f : ssop5 : sop8 tr: embossed tape and reel (ssop5) e2: embossed tape and reel (sop8) line-up t opr channels package orderable part number -40c to +85c 1ch ssop5 reel of 3000 bu7250g-tr 2ch sop8 reel of 2500 bu7253f-e2 -40c to +105c 1ch ssop5 reel of 3000 BU7250SG-TR 2ch sop8 reel of 2500 bu7253sf-e2 absolute maximum ratings (t a =25c) parameter symbol rating unit bu7250g bu7253f bu7250sg bu7253sf supply voltage vdd-vss +7 v power dissipation p d ssop5 0.54 (note 1,3) - 0.54 (note 1,3) - w sop8 - 0.55 (note 2,3) - 0.55 (note 2,3) differential input voltage (note 4) v id vdd - vss v input common-mode voltage range v icm (vss - 0.3) to (vdd + 0.3) v input current (note 5) i i 10 ma operating supply voltage v opr +1.8 to +5.5 0.9 to 2.75 v operating temperature t opr -40 to +85 -40 to +105 c storage temperature t stg -55 to +125 c maximum junction temperature t jmax +125 c (note 1) to use at temperature above t a =25 ? c reduce 5.4mw/ ? c. (note 2) to use at temperature above t a =25 ? c reduce 5.5mw/ ? c. (note 3) mounted on a fr4 glas s epoxy pcb 70mm70mm1.6mm (copper foil area less than 3%). (note 4) the voltage difference between inverting input and non-inverting input is the differential input voltage. then input pin voltage is set to more than vss. (note 5) an excessive input current will flow when input voltages of more than vdd+0.6v or less than vss-0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as ad ding a fuse, in case the ic is operated over the absolute maximum ratings.
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 3/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf electrical characteristics bu7250g, bu7250sg unless otherwise specified vdd=+3v, vss=0v, t a =25c parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 6) v io 25c - 1 11 mv - input offset current (note 6) i io 25c - 1 - pa - input bias current (note 6) i b 25c - 1 - pa - supply current (note 7) i dd 25c - 15 35 a r l = full range - - 50 maximum output voltage(high) v oh 25c vdd-0.1 - - v r l =10k ? , v rl =3v maximum output voltage(low) v ol 25c - - vss+0.1 v r l =10k ? large signal voltage gain a v 25c - 90 - db r l =10k ? input common-mode voltage range v icm 25c 0 - 3 v vss to vdd common-mode rejection ratio cmrr 25c - 80 - db - power supply rejection ratio psrr 25c - 80 - db - output sink current (note 8) i sink 25c 3 6 - ma out=vss+0.4v output fall time t f 25c - 20 - ns r l =10k ? , v rl =3v c l =15pf, in-=1.5v 100mv overdrive propagation delay time (l to h) t plh 25c - 0.75 - s r l =10k ? , v rl =3v c l =15pf, in-=1.5v 100mv overdrive propagation delay time (h to l) t phl 25c - 0.25 - s r l =10k ? , v rl =3v c l =15pf, in-=1.5v 100mv overdrive (note 6) absolute value (note 7) full range: bu7250g: t a =-40c to +85c bu7250sg: t a =-40c to +105c (note 8) under the high temperature envir onment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the ou tput current is reduced to clim b to the temperature inside ic .
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 4/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf electrical characteristics - continued bu7253f, bu7253sf unless otherwise specified vdd=+3v, vss=0v, t a =25c parameter symbol temperature range limit unit conditions min typ max input offset voltage (note 9) v io 25c - 1 11.5 mv - input offset current (note 9) i io 25c - 1 - pa - input bias current (note 9) i b 25c - 1 - pa - supply current (note 10) i dd 25c - 35 65 a r l = all comparators full range - - 130 maximum output voltage(high) v oh 25c vdd-0.1 - - v r l =10k ? , v rl =3v maximum output voltage(low) v ol 25c - - vss+0.1 v r l =10k ? large signal voltage gain a v 25c - 90 - db r l =10k ? input common-mode voltage range v icm 25c 0 - 3 v vss to vdd common-mode rejection ratio cmrr 25c - 80 - db - power supply rejection ratio psrr 25c - 80 - db - output sink current (note 11) i sink 25c 3 6 - ma out=vss+0.4v output fall time t f 25c - 20 - ns r l =10k ? , v rl =3v c l =15pf, in-=1.5v 100mv overdrive propagation delay time (l to h) t plh 25c - 0.75 - s r l =10k ? , v rl =3v c l =15pf, in-=1.5v 100mv overdrive propagation delay time (h to l) t phl 25c - 0.25 - s r l =10k ? , v rl =3v c l =15pf, in-=1.5v 100mv overdrive (note 9) absolute value (note 10) full range: bu7253f: t a =-40c to +85c bu7253sf: t a =-40c to +105c (note 11) under the high temperature environm ent, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the ou tput current is reduced to clim b to the temperature inside ic .
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 5/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf description of electrical characteristics described below are descriptions of the rele vant electrical terms used in this datasheet. items and symbols used are also shown. note that item name and symbol and their meaning ma y differ from those on another manufacturer?s document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) supply voltage (vdd/vss) indicates the maximum voltage that can be applied between the vdd terminal and vss terminal without deterioration or destruction of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied betw een non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common-mode voltage range of the maximum ratings does not assure normal operation of ic. for normal operation, use the ic within the input common-mode voltage range characteristics. (4) power dissipation (p d ) indicates the power that can be consumed by the ic wh en mounted on a specific board at the ambient temperature 25 c (normal temperature). as for package product, p d is determined by the temperature that can be permitted by the ic in the package (maximum junction temperature) and the thermal resistance of the package. 2. electrical characteristics (1) input offset voltage (v io ) indicates the voltage difference between non-inverting termi nal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. (2) input offset current (i io ) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. (3) input bias current (i b ) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) supply current (i dd ) indicates the current that flows within the ic under specified no-load conditions. (5) maximum output voltage(high) / maximum output voltage(low) (v oh /v ol ) indicates the voltage range of the outpu t under specified load condition. it is typically divided into maximum output voltage high and low. maximum output voltage high indica tes the upper limit of out put voltage. maximum output voltage low indicates the lower limit. (6) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. av = (output voltage) / (differential input voltage) (7) input common-mode voltage range (v icm ) indicates the input voltage range where ic normally operates. (8) common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) (9) power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volta ge)/(input offset fluctuation) (10) output source current/ output sink current (i source / i sink ) the maximum current that c an be output from the ic under specific output conditions. the output source current indicates the current flowing out from the ic, and the output sink current indica tes the current flowing into the ic. (11) output fall time (t f ) indicates the time required for an output voltage step to change from 90% to 10% of its final value. (12) propagation delay time (l to h) / propagation delay time (h to l) (t plh / t phl ) indicates the time to reach 50% of the output voltage after the step voltage is applied at the input pin.
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 6/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf typical performance curves bu7250g, bu7250sg (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7250g: -40 ? c to +85 ? c bu7250sg: -40 ? c to +105 ? c 0 5 10 15 20 25 30 35 123456 supply voltage [v] supply current [ a] 0 5 10 15 20 25 30 35 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [ a] figure 1. power dissipation vs ambient temperature (derating curve) figure 2. power dissipation vs ambient temperature (derating curve) figure 3. supply current vs supply voltage figure 4. supply current vs ambient temperature -40c 25c 85c 105c 1.8v 5.5v 3.0v 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7250g 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7250sg 85 105
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 7/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf typical performance curves - continued bu7250g, bu7250sg (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7250g: -40 ? c to +85 ? c bu7250sg: -40 ? c to +105 ? c 0 1 2 3 4 5 6 123456 supply voltage [v] maximum output voltage (high) [v] 0 5 10 15 20 25 30 123456 output voltage [v] maximum output voltage (low) [mv] 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] figure 7. maximum output voltage (low) vs supply voltage (r l =10k ? ) figure 5. maximum output voltage (high) vs supply voltage (r l =10k ? , v rl =3v) figure 6. maximum output voltage (high) vs ambient temperature (r l =10k ? , v rl =3v) figure 8. maximum output voltage (low) vs ambient temperature (r l =10k ? ) -40c 25c 85c 105c 1.8v 5.5v 3.0v -40c 25c 85c 105c 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] 1.8v 5.5v 3.0v
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 8/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf figure 10. output sink current vs ambient temperature (out=vss-0.4v) typical performance curves - continued bu7250g, bu7250sg (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7250g: -40 ? c to +85 ? c bu7250sg: -40 ? c to +105 ? c -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 123456 supply voltage [v] input offset voltage [mv] 0 4 8 12 16 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] 0 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output sink current [ma] figure 9. output sink current vs output voltage (vdd=3 v) -40c 25c 85c 105c 1.8v 5.5v 3.0v figure 11. input offset voltage vs supply voltage (v icm =vdd, e k =-vdd/2) figure 12. input offset voltage vs ambient temperature (v icm =vdd, e k =-vdd/2) -40c 25c 85c 105c 5.5v 3.0v 1.8v
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 9/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf typical performance curves - continued bu7250g, bu7250sg (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7250g: -40 ? c to +85 ? c bu7250sg: -40 ? c to +105 ? c 0 20 40 60 80 100 120 123456 supply voltage [v] common-mode rejection ratio [db] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -101234 supply voltage [v] input offset voltage [mv] figure 13. input offset voltage vs supply voltage (vdd=3v) figure 14. large signal voltage gain vs supply voltage figure 15. large signal voltage gain vs ambient temperature figure 16. common-mode rejection ratio vs supply voltage -40c 25c 85c 105c -40c 25c 85c 105c 60 80 100 120 140 160 123456 su pply voltage [v] large signal voltage gain [db] -40c 25c 85c 105c 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 5.5v 1.8v 3.0v
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 10/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf typical performance curves - continued bu7250g, bu7250sg (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7250g: -40 ? c to +85 ? c bu7250sg: -40 ? c to +105 ? c 0 20 40 60 80 100 120 -50-25 0 255075100125 ambient temperature [c] common-mode rejection ratio [db] figure 17. common-mode rejection ratio vs ambient temperature figure 18. power supply rejection ratio vs ambient temperature figure 19. propagation delay time (l to h) vs ambient temperature (r l =10k ? , v rl =3v, c l =15pf in-=1.5v, 100mv overdrive) figure 20. propagation delay time (h to l) vs ambient temperature (r l =10k ? , v rl =3v, c l =15pf in-=1.5v, 100mv overdrive) 5.5v 1.8v 3.0v 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] 0.0 0.5 1.0 1.5 2.0 2.5 -50-25 0 255075100125 ambient temperature [c] propagation delay time(l to h) [s] 5.5v 1.8v 3.0v 0.0 0.3 0.6 0.9 1.2 1.5 -50-25 0 255075100125 ambient temperature [c] propagation delay time(h to l) [s] 5.5v 1.8v 3.0v
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 11/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf typical performance curves - continued bu7253f, bu7253sf (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7253f: -40? c to +85 ? c bu7253sf: -40 ? c to +105 ? c 0 20 40 60 80 123456 supply voltage [v] supply current [ a] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0 20 40 60 80 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [ a] figure 21. power dissipation vs ambient temperature (derating curve) figure 22. power dissipation vs ambient temperature (derating curve) figure 23. supply current vs supply voltage figure 24. supply current vs ambient temperature -40c 25c 85c 105c 1.8v 5.5v 3.0v 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7253f bu7253sf 85 105
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 12/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf typical performance curves - continued bu7253f, bu7253sf (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7253f: -40? c to +85 ? c bu7253sf: -40 ? c to +105 ? c 0 1 2 3 4 5 6 123456 supply voltage [v] maximum output voltage (high) [v] 0 5 10 15 20 25 30 123456 supply voltage [v] maximum output voltage (low) [mv] 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] figure 27. maximum output voltage (low) vs supply voltage (r l =10k ? ) figure 25. maximum output voltage (high) vs supply voltage (r l =10k ? ) figure 26. maximum output voltage (high) vs ambient temperature (r l =10k ? ) figure 28. maximum output voltage (low) vs ambient temperature (r l =10k ? ) -40c 25c 85c 105c 1.8v 5.5v 3.0v -40c 25c 85c 105c 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] 1.8v 5.5v 3.0v
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 13/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf figure 30. output sink current vs ambient temperature (out=vdd-0.4v) typical performance curves - continued bu7253f, bu7253sf (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7253f: -40? c to +85 ? c bu7253sf: -40 ? c to +105 ? c -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 123456 supply voltage [v] input offset voltage [mv] 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] 0 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 output voltage [v] output sink current [ma] figure 29. output sink current vs output voltage (vdd=3 v) -40c 25c 85c 105c 1.8v 5.5v 3.0v figure 31. input offset voltage vs supply voltage (v icm =vdd, e k =-vdd/2) figure 32. input offset voltage vs ambient temperature (v icm =vdd, e k =-vdd/2) -40c 25c 85c 105c 5.5v 3.0v 1.8v
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 14/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf typical performance curves - continued bu7253f, bu7253sf (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7253f: -40? c to +85 ? c bu7253sf: -40 ? c to +105 ? c 0 20 40 60 80 100 120 123456 supply voltage [v] common-mode rejection ratio [db] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -101234 supply voltage [v] input offset voltage [mv] figure 33. input offset voltage vs supply voltage (vdd=3v) figure 34. large signal voltage gain vs supply voltage figure 35. large signal voltage gain vs ambient temperature figure 36. common-mode rejection ratio vs supply voltage -40c 25c 85c 105c -40c 25c 85c 105c 60 80 100 120 140 160 123456 su pply voltage [v] large signal voltage gain [db] -40c 25c 85c 105c 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 5.5v 1.8v 3.0v
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 15/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf typical performance curves - continued bu7253f, bu7253sf (*)the above characteristics are measurements of typical sample, they are not guaranteed. bu7253f: -40? c to +85 ? c bu7253sf: -40 ? c to +105 ? c 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] common-mode rejection ratio [db] 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] figure 37. common-mode rejection ratio vs ambient temperature figure 38. power supply rejection ratio vs ambient temperature figure 39. propagation delay time (l to h) vs ambient temperature (r l =10k ? , v rl =3v, c l =15pf in-=1.5v, 100mv overdrive) figure 40. propagation delay time (h to l) vs ambient temperature (r l =10k ? , v rl =3v, c l =15pf in-=1.5v, 100mv overdrive) 5.5v 1.8v 3.0v 0.0 0.5 1.0 1.5 2.0 2.5 -50 -25 0 25 50 75 100 125 ambient temperature [c] propagation delay time(l to h) [s] 5.5v 1.8v 3.0v 0.0 0.3 0.6 0.9 1.2 1.5 -50-250 255075100125 ambient temperature [c] propagation delay time(h to l) [s] 5.5v 3.0v 1.8v
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 16/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf application information null method conditions for test circuit 1 vdd, vss, e k , v icm unit: v parameter v f sw1 sw2 sw3 vdd vss e k v icm calculation input offset voltage v f1 on on off 3 0 -0.1 3 1 large signal voltage gain v f2 on on on 3 0 -0.3 0.3 2 v f3 -2.7 common-mode rejection ratio (input common-mode voltage range) v f4 on on off 3 0 -0.1 0 3 v f5 3 power supply rejection ratio v f6 on on off 1.8 0 -0.1 0.3 4 v f7 5.5 - calculation - 1. input offset voltage (v io ) 2. large signal voltage gain (a v ) 3. common-mode rejection ratio (cmrr) 4. power supply rejection ratio (psrr) figure 41. test circuit 1 |v f5 -v f4 | cmrr = 20log ? v icm (1+r f / r s ) [db] a v = 20log |v f3 -v f2 | ? e k (1+r f / r s ) [db] psrr = 20log |v f7 - v f6 | ? vdd (1+ r f / r s ) [db] v io = 1 + r f / r s [v] |v f1 | v icm r s =50 ? r s =50 ? r f =50k ? r i =1m? r i =1m? 0.1 f 0.1 f sw1 sw2 50k ? sw3 r l v rl 0.47 f e k 500k ? 500k ? v f 0.01 f 15v -15v vdd vss vo v null dut
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 17/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf output wave t plh t f input wave input voltage input wave input voltage t output voltage (l-h) 0v 3v 1.5v 50% 10% 50% 10% 90% t phl output voltage (h-l) 1.4v 1.6v t 1.5v 100mv overdrive 1.4v 1.6v t v re 1.5v 100mv overdrive output wave t 0v 3v 1.5v application information - continued switch conditions for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 sw6 sw7 sw8 supply current off on on off off off off off maximum output voltage (r l =10k ? ) off on on on off off on off output current off off off off off on off off response time on off on off on off off on figure 42. test circuit 2 figure 43. response time input and output wave sw1 sw2 + - sw5 sw6 sw7 sw4 sw3 c l sw8 vss vdd out in+ in- r l v rl v in
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 18/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). maximum junction temperature is typically equal to the maximum storage temperature. the heat generated through the consumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 44(a) shows the model of the thermal resistance of the package. the equation below shows how to compute for the thermal resistance ( ja ), given the ambient temperature (t a ), maximum junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax -t a ) / p d c/w the derating curve in figure 44(b) indicates the power that the ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certain temperatures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 44(c) to (f) shows the derating curve for bu7250g, bu7250sg, bu7253f and bu7253sf. 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7250g (n o t e 12) bu7250sg (n o t e 12) (c) bu7250g (d) bu7250sg 85 105 (b) derating curve a mbient temperature t a [ ? c ] chip surface temperature t j [ ? c] (a) thermal resistance ja =(t jmax -t a )/p d ? c/w 0 a mbient temperature t a [ ? c] p2 p1 25 125 75 100 50 power dissipation of lsi [w] p dma x t jma x ja2 ja1 ja2 < ja1 power dissipation of ic
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 19/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf (note 12) (note 13) unit 5.4 5.5 mw/c when using the unit above t a =25c, subtract the value above per cels ius degree. power dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (copper foil area less than 3%) is mounted. figure 44. thermal resistance and derating curve 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bu7253f (n o t e 13) (e) bu7253f (f) bu7253sf 85 105 bu7253sf (n o t e 13)
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 20/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the p d stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line.
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 21/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf operational notes ? continued 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevit ably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasiti c elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a vo ltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this ic. 13. unused circuits when there are unused comparators, it is recommended that they are connected as in figure 45, setting the non-inverting input terminal to a potential within the in-phase input voltage range (v icm ). 14. input voltage applying vdd +0.3v to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 15. power supply(single/dual) the voltage comparator operates when the voltage supplied is between vdd and vss. ther efore, the single supply voltage comparator can be used as dual supply voltage comparator as well. 16. output capacitor if a large capacitor is connected between the output pin and vss pin, current from the char ged capacitor will flow into the output pin and may destroy the ic when the vdd pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 0.1f between output pin and vss pin. 17. oscillation by output capacitor please pay attention to the oscillation by output capacito r and in designing an applicat ion of negative feedback loop circuit with these ics. 18. latch up be careful of input voltage that exceed the vdd an d vss. when cmos device have sometimes occur latch up and protect the ic from abnormaly noise. 19. open drain output please connect and use a pull-up resistor to t he output since this ic has an open-drain output. vss vdd figure 45. example of application circuit for unused comparator
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 22/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf physical dimensions, tape and reel information package name ssop5
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 23/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf physical dimensions, tape and reel information ? continued package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr))
datasheet www.rohm.com tsz02201-0rfr1g200450-1-2 ? 2013 rohm co., ltd. all rights reserved. 24/24 4.dec.2013 rev.001 tsz22111 ? 15? 001 bu7250g bu7250sg bu7253f bu7253sf marking diagram product name package type marking bu7250 g ssop5 3 bu7250s 4 bu7253 f sop8 7253 bu7253s 7253s land pattern data all dimensions in mm package land pitch e land space mie land length R? 2 land width b2 ssop5 0.95 2.4 1.0 0.6 sop8 1.27 4.60 1.10 0.76 revision history date revision changes 4.dec.2013 001 new release sop8 mie ? 2 b2 e sop8(top view) part number marking lot number 1pin mark part number marking ssop5(top view) lot number ssop5 ? e e ? 2 b2 mie
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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